TSMC Aims for Trillion-Transistor Chips, 1nm Manufacturing Process

According to Techspot , at the recent IEDM conference, TSMC announced a product roadmap for its next-generation semiconductor manufacturing processes that will eventually culminate in multiple 3D stacked chiplet designs with 1 trillion transistors on a single chip package. Advances in packaging technologies, such as CoWoS, InFO, and SoIC, will enable the company to achieve that goal, and by 2030, TSMC believes its monolithic designs could reach 200 billion transistors.

TSMC believes it can create 1nm chips by 2030

Nvidia's 80-billion-transistor GH100 is one of the most complex monolithic chips on the market. However, as these chips continue to grow in size and become more expensive, TSMC believes manufacturers will adopt multi-chiplet architectures, such as AMD's recently launched Instinct MI300X and Intel's 100-billion-transistor Ponte Vecchio.

For now, TSMC will continue to develop its 2nm N2 and N2P manufacturing processes as well as the 1.4nm A14 and 1nm A10 chips. The company plans to start 2nm production by the end of 2025. In 2028, it will move to the 1.4nm A14 process, and by 2030, it plans to produce 1nm transistors.

Meanwhile, Intel is working on a 2nm (20A) and 1.8nm (18A) process, which are expected to launch around the same time frame. One advantage of the new technology is that it offers higher logic density, increased clock speeds, and lower leakage, leading to more energy-efficient designs.

TSMC's goal of developing the next generation of advanced chips

As the world's largest foundry, TSMC is confident its manufacturing processes will outperform anything Intel has to offer. During an earnings call, TSMC CEO CC Wei said internal reviews confirmed the improvements in N3P technology and that the company's 3nm manufacturing process proved "PPA comparable" to Intel's 18A process. He expects N3P to be even better, more competitive, and have a significant cost advantage.

Meanwhile, Intel CEO Pat Gelsinger claimed that their 18A manufacturing process will outperform TSMC's 2nm chips released a year earlier. Of course, only time will tell.

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