The Fab-Lab project is considered a pioneering model in Vietnam in the field of microchip packaging, with strategic significance in developing core technology, concretizing Resolution No. 57-NQ/TW of the Politburo and the Strategy for developing Vietnam's semiconductor industry to 2030, with a vision to 2050 according to Decision No. 1018/QD-TTg of the Prime Minister.
The project is invested with a total capital of 1,800 billion VND, built on an area of 2,288m² with a total floor area of over 5,700m², expected to come into operation in the fourth quarter of 2026.
The project is divided into two main areas: the lab area to research new packaging technologies such as FOWLP, 2.5D/3D IC, Silicon Interposer, Silicon-Bridge; and the fab area to conduct trial production on real wafers, applying modern equipment such as lithography, wafer bonding, international standard measurement and testing systems. When completed, Fab-Lab is expected to reach a capacity of 10 million products/year, serving both domestic and international markets.
Speaking at the ceremony, Minister of Science and Technology Nguyen Manh Hung emphasized the role of packaging and testing as a strategic link, helping Vietnam participate more deeply in the global semiconductor value chain.
The project is a flexible coordination model between the State and enterprises, with the Lab as a center for testing innovation, laying the foundation for training high-quality human resources, attracting investment, and transferring technology.
The Ministry of Science and Technology is committed to accompanying Da Nang in building a mechanism to support research and testing infrastructure, connecting national and international programs in the fields of packaging, design, and testing of microchips.
Da Nang City leaders also affirmed that the development of science, technology, innovation and digital transformation is the leading breakthrough in the 2025-2030 term. VSAP Lab is expected to become a model "lab-fab" - integrating research, testing, production and training - serving advanced microchip packaging for AI chips, sensors, biomedicine and high-speed communication devices.
The city is committed to creating favorable conditions in terms of infrastructure, administrative mechanisms and human resources for the project to be implemented on schedule, safely and effectively. VSAP Lab will be the nucleus of forming a semiconductor innovation cluster, contributing to realizing the aspiration of building Da Nang into a high-tech center of the country and hoping to become a "magnet" attracting brainpower, the cradle of advanced packaging technology "Make in Vietnam".
Immediately after the ceremony, the delegation of the Ministry of Science and Technology visited the FPT High Technology and Semiconductor Chip R&D Center and the microchip design training class at Da Nang Software Park No. 2.
Source: https://baovanhoa.vn/nhip-song-so/da-nang-khoi-dong-du-an-fablab-1800-ti-dong-156911.html
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