The alliance focuses on rapidly deploying silicon and system-level innovations that enable next-generation computing and mobile applications using TSMC's 3DFabric technology.
Keysight just joined TSMC's alliance
As a member of the 3DFabric Alliance, Keysight has access to the TSMC 3Dblox standard, which is aimed at developing electronic design automation (EDA) software and test solutions. Keysight will have access to 3DFabric technologies to optimize design tools and processes to accelerate the 3D IC design process. Additionally, Keysight will collaborate with TSMC on test and measurement methods to ensure the quality and reliability of 3D IC designs.
Keysight will also participate in TSMC's 3Dblox standardization activities to address the increasing complexity of 3D IC designs. The 3Dblox standard unifies the design ecosystem with standardized EDA tools and workflows. This modular standard models key physical protocols and logical interconnect information in 3D IC designs in a single format.
“TSMC works closely with our 3DFabric Alliance partners to enable customers to easily and flexibly harness the power of 3D ICs in their designs,” said Dan Kochpatcharin, head of design infrastructure at TSMC. “Keysight’s addition to the 3DFabric Alliance adds unique design and test expertise to our growing 3D semiconductor design community. Through the 3DFabric Alliance, TSMC and Keysight will collaborate to provide high-quality design and test solutions and services to help customers rapidly deploy system-level innovation and bring differentiated 3D IC products to market.”
“TSMC is paving the way for 3D IC design processes and technologies,” said Nilesh Kamdar, senior director, product portfolio manager at Keysight. “Our membership in the 3DFabric Alliance brings our expertise in high-speed design and test, high-frequency design to the 3D semiconductor design community. Keysight’s simulation and test tools are well-suited to ensure customers who are innovating for tomorrow’s mobile applications can successfully design 3D ICs using TSMC technology.”
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